The vacuum butterfly valve is one of the indispensable components in the semiconductor industry. Its precision machining and high quality requirements play a vital role in the production efficiency and product quality of the semiconductor industry. In this paper, we will discuss the manufacturing process, related technologies and applications of vacuum butterfly valves for semiconductor devices.
Vacuum butterfly valve precision manufacturing process:
The manufacturing process of vacuum butterfly valve for semiconductor equipment is very complicated, requiring highly precise machining technology and strict quality control. The manufacturing process includes: mechanical drawing, CNC machining, heat treatment, surface treatment, assembly and testing. Among them, CNC machining is the most critical step, requiring high-precision machine tools and tools to ensure the geometric shape and dimensional accuracy of parts.
Vacuum butterfly valve precision manufacturing technology:
Semiconductor equipment vacuum butterfly valve manufacturing involves a variety of related technologies, including CAD design, CNC machining, heat treatment, surface treatment, assembly and testing. In drawing design, professional 3D modeling software is needed to ensure the precision and accuracy of parts. In NC machining, it is necessary to use high precision NC machine tools and precision tools to realize high precision machining of parts. In heat treatment, the speed and temperature of heating and cooling need to be controlled to ensure the hardness and accuracy of parts. In surface treatment, grinding, polishing, electroplating and other processes are needed to improve the surface finish and corrosion resistance of parts.
Semiconductor equipment butterfly valve precision manufacturing difficulties:
Material selection: The vacuum butterfly valve of semiconductor equipment needs to use high-quality materials, such as high-purity stainless steel, copper, aluminum, titanium and other materials, to ensure the chemical stability, low gas release rate and high mechanical strength of the material.
Design complexity: semiconductor equipment vacuum butterfly valves are usually used in complex structure and design, to meet the requirements of high precision and high stability. When designing butterfly valves, it is necessary to consider multiple parameters, such as fluid dynamics, thermodynamics, material strength, corrosion resistance and other factors, as well as different scenarios and requirements in practical applications.
High precision processing: vacuum butterfly valves for semiconductor equipment need to use very high precision processing technology to achieve micron level to a higher level of processing accuracy. The machining process requires the use of very advanced CNC machining equipment, electric discharge machining, laser machining and other high-precision machining tools and equipment.
Precision measurement and testing: vacuum butterfly valves of semiconductor equipment need to undergo strict precision measurement and testing after manufacturing to ensure that they meet the design requirements and high precision manufacturing standards. Precision measurement and detection include three coordinate measurement, high precision surface roughness measurement, vacuum sealing test, high precision visual defect detection, etc.
High cleanliness and purity requirements: Vacuum butterfly valves of semiconductor devices need to meet high cleanliness and purity requirements during use, because impurities, pollutants and gas can have a fatal impact on the semiconductor manufacturing process. Therefore, it is necessary to adopt a high cleanliness production environment and process in the manufacturing process to ensure that the cleanliness and purity of the vacuum butterfly valve of semiconductor equipment meet the requirements.
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Photo source: VAT official website
Components of semiconductor vacuum butterfly valve:
Valve body: The valve body is one of the main components of the vacuum butterfly valve of semiconductor equipment, usually using high precision CNC machining and electric discharge machining process manufacturing. The design of valve body needs to consider hydrodynamics, thermodynamics, etc.
Disc: Disc is one of the key components of the vacuum butterfly valve in semiconductor equipment, and is usually made of high quality materials, such as stainless steel, copper, aluminum, titanium and other materials. The design of valve disc needs to consider fluid dynamics, thermodynamics, etc., to ensure that the valve disc has the characteristics of high precision and high stability.
Transmission mechanism: Transmission mechanism is one of the important parts of the vacuum butterfly valve of semiconductor equipment, usually composed of motor, reducer, drive shaft and other components, used to control the opening and closing of the valve disc. The transmission mechanism needs to have the characteristics of high precision and high reliability to ensure the normal operation of the valve.
Sealing system: The sealing system is one of the key components of the vacuum butterfly valve of semiconductor equipment. It is usually composed of elastic sealing ring, gas-tight connector and other components to ensure the vacuum sealing of the valve in the closed state. The sealing system needs to have the characteristics of high precision, high sealing and high durability, which is an important guarantee to ensure the stability and reliability of the vacuum butterfly valve of semiconductor equipment.
Driving circuit and control system: The driving circuit and control system is the control center of the vacuum butterfly valve of semiconductor equipment, which is used to control the opening and closing of the valve, adjust the valve flow and pressure and other parameters. The driving circuit and control system need to have the characteristics of high precision, high speed and high reliability to ensure the normal operation of the vacuum butterfly valve of semiconductor equipment.
Vacuum butterfly valve in semiconductor equipment industry application:
Vacuum butterfly valve is widely used in semiconductor industry. It can be used in semiconductor material preparation, wafer processing, photolithography, film deposition and many other links. Through the control of gas and liquid, the stability and precision requirements of semiconductor manufacturing can be achieved.
To sum up:
The vacuum butterfly valve is an indispensable component in the semiconductor industry. Its manufacturing process and related technology require high precision machining and strict quality control. In the semiconductor manufacturing process, the semiconductor equipment vacuum butterfly valve can realize the precise control of gas and liquid, to ensure the stability and precision requirements of semiconductor products. Precision machining, CAD design, CNC machining, heat treatment, surface treatment and other technologies are important links in the manufacturing process of vacuum butterfly valve for semiconductor equipment. Keywords include semiconductor equipment vacuum butterfly valve, precision machining, CAD design, CNC machining, heat treatment, surface treatment, semiconductor material preparation, wafer processing, photolithography, thin film deposition, etc.